Testing Socket

Product Overview

Regarding semiconductor packaging IC and SIP, Aethertek has extensive experiences in designing customized socket which is applicable from engineering characterization to mass production. Our sockets are made of a wide range of material options including high-performance engineering plastics and aluminum to meet various test conditions and requirements.

Socket General Features

Specifications
Package All kinds of package
(SIP, SOP, SSOP, TSSOP, BGA, QFN, QFP, LGA, etc.)
Pitch ≥ 0.30mm
Resistance < 100mΩ or less
Type (Performance)
  1. Open level clamshell
  2. Open knob clamshell
  3. Automated& Shielding
  4. High Frequency
Type (Reliability) 1.(REL)
Temperature -40 ~ 85℃
Current Rating 0.5 ~ 2A
Features
  • Self-balancing pressing block component
  • Customized modules to meet DUT specifications& characteristics
  • Flexible probe configuration
  • Lost cost and high life cycle test solution

Application- SIP & IC

SIP (System-in- Package)

Applicable for all kinds of deformation SIP

IC Package

  • Applicable for common IC package size
  • Customizable to meet required specification

Socket Comparison

  • Open Clamshell
  • Automated& shielding
  • High Frequency

Open Clamshell

Performance
  • Modular design, equipped with high performance pogo pins to achieve stable production and verification use
  • Heat sink fins can be installed to enhance the performance of heat dissipation and heat conduction
  • A larger number of probes can be placed to meet the test requirement
Reliability
  • Equipped with special pogo pins for reliability testing under harsh conditions
  • Operating environment: Salt Spray testing/ High humidity testing/ thermal shock testing
  • Individual component is made of special materials and special
  • Reduce DUT covering area to ensure exposure to the test environment

Automated& shielding

Performance
  • Modular Socket is equipped with high-performance& high-frequency pogo pins to achieve high stability and use for DUT signal shielding purposes
  • Control board with shielding boxes to achieve the RF automatic test (Calibration, comprehensive test& Wifi)
  • Shielding effectiveness: 2.4GHz ≥ 55dB; 5GHz ≥ 40dB
Reliability
  • Equipped with special pogo pins for reliability testing under harsh conditions
  • Operating environment: Salt Spray testing/ High humidity testing/ thermal shock testing
  • Individual component is made of special materials and special
  • Reduce DUT covering area to ensure exposure to the test environment

High Frequency

Performance
  • Modular socket equipped with high-performance& high frequency pogo pins to achieve DUT RF signal transmission and production test use
  • Optional non-metallic structural components to reduce signal interference
  • High-pressure air pipe can be installed to increase heat dissipation efficiency
Reliability
  • Equipped with special pogo pins for reliability testing under harsh conditions
  • Operating environment: Salt Spray testing/ High humidity testing/ thermal shock testing
  • Individual component is made of special materials and special
  • Reduce DUT covering area to ensure exposure to the test environment

We provide customized solutions

From professional consulting to design and production, we offer customized solutions that bring higher value to your products.