Regarding semiconductor packaging IC and SIP, Aethertek has extensive experiences in designing customized socket which is applicable from engineering characterization to mass production. Our sockets are made of a wide range of material options including high-performance engineering plastics and aluminum to meet various test conditions and requirements.
Advantages
- Spring Loaded Pusher – Provide precise force to DUT
- Floating Plate – Design for precision alignment
- Hard Stop – Eliminate potential damage to DUT
- Mounting plate & Stiffener – Optional kits for mechanical reinforcement
Specifications
| Package | All kinds of package (SIP, SOP, SSOP, TSSOP, BGA, QFN, QFP, LGA, etc.) |
| Pitch | ≥ 0.30mm |
| Resistance | < 100mΩ or less |
| Type (Performance) |
|
| Type (Reliability) | 1.(REL) |
| Temperature | -40 ~ 85℃ |
| Current Rating | 0.5 ~ 2A |
Features
- Self-balancing pressing block component
- Customized modules to meet DUT specifications& characteristics
- Flexible probe configuration
- Lost cost and high life cycle test solution
Application
SIP (System-in- Package)
Applicable for all kinds of deformation SIP
IC Package
QFP / QFN / SOP / SON / BGA / LGA
- Applicable for common IC package size
- Customizable to meet required specification
