Socket

Micro Probes

Regarding semiconductor packaging IC and SIP, Aethertek has extensive experiences in designing customized socket which is applicable from engineering characterization to mass production. Our sockets are made of a wide range of material options including high-performance engineering plastics and aluminum to meet various test conditions and requirements.

Advantages

Spring Loaded Pusher – Provide precise force to DUT
Floating Plate – Design for precision alignment
Hard Stop – Eliminate potential damage to DUT
Mounting plate & Stiffener – Optional kits for mechanical reinforcement

Specifications

Package	All kinds of package (SIP, SOP, SSOP, TSSOP, BGA, QFN, QFP, LGA, etc.)
Pitch	≥ 0.30mm
Resistance	< 100mΩ or less
Type (Performance)	Open level clamshell Open knob clamshell Automated& Shielding High Frequency
Type (Reliability)	1.(REL)
Temperature	-40 ~ 85℃
Current Rating	0.5 ~ 2A

Features

Self-balancing pressing block component
Customized modules to meet DUT specifications& characteristics
Flexible probe configuration
Lost cost and high life cycle test solution

Application

SIP (System-in- Package)
Applicable for all kinds of deformation SIP

IC Package
QFP / QFN / SOP / SON / BGA / LGA

Applicable for common IC package size
Customizable to meet required specification

Socket Comparison

Open Clamshell

Performance

Modular design, equipped with high performance pogo pins to achieve stable production and verification use
Heat sink fins can be installed to enhance the performance of heat dissipation and heat conduction
A larger number of probes can be placed to meet the test requirement

Reliability

Equipped with special pogo pins for reliability testing under harsh conditions
Operating environment: Salt Spray testing/ High humidity testing/ thermal shock testing
Individual component is made of special materials and special
Reduce DUT covering area to ensure exposure to the test environment

Automated & Shielding

Performance

Modular Socket is equipped with high-performance& high-frequency pogo pins to achieve high stability and use for DUT signal shielding purposes
Control board with shielding boxes to achieve the RF automatic test (Calibration, comprehensive test& Wifi)
Shielding effectiveness: 2.4GHz ≥ 55dB; 5GHz ≥ 40dB

Reliability

Equipped with special pogo pins for reliability testing under harsh conditions
Operating environment: Salt Spray testing/ High humidity testing/ thermal shock testing
Individual component is made of special materials and special
Reduce DUT covering area to ensure exposure to the test environment

High Frequency

Performance

Modular socket equipped with high-performance& high frequency pogo pins to achieve DUT RF signal transmission and production test use
Optional non-metallic structural components to reduce signal interference
High-pressure air pipe can be installed to increase heat dissipation efficiency

Reliability

Equipped with special pogo pins for reliability testing under harsh conditions
Operating environment: Salt Spray testing/ High humidity testing/ thermal shock testing
Individual component is made of special materials and special
Reduce DUT covering area to ensure exposure to the test environment